Spring contacts are applicable to:
★Centering / concentricity
★Holding / control
★Conducting
★Latching / locking device
★EMI / RFI shielding
★Tolerance compensation
★Grounding
★Sealing
Wire diameter: 0.10mm - 1.5mm
Material: Copper alloy, stainless steel, special alloy, etc.
Surface treatment: Gold plating, silver plating, nickel plating, tin plating; Plating Au/Ag/Ni/Sn
The Multi-Contact canted coil spring is a precision spring element engineered to provide continuous electrical grounding and electromagnetic shielding performance in advanced electronic and electromechanical systems. Through its angled coil structure, the spring creates multiple simultaneous contact points, ensuring low and stable impedance between mating surfaces.
Unlike conventional grounding clips or finger contacts, this type of canted coil spring delivers uniform radial or axial contact pressure, maintaining reliable electrical continuity even under vibration, thermal expansion, or repeated assembly cycles. YFS Technology (SZ) Co., Ltd develops this spring as part of an integrated connector and grounding solution, supporting high-performance EMI control and system-level signal integrity.
The Multi-Contact Canted Coil Spring is particularly suitable for applications where shielding effectiveness, grounding stability, and long-term reliability are critical design requirements.
The angled coil geometry generates multiple conductive contact points, significantly reducing contact resistance and improving grounding consistency.
Maintains continuous electrical connection between conductive surfaces, supporting effective EMI suppression.
Provides evenly distributed contact force, preventing localized wear or intermittent grounding.
Enables high shielding performance in limited installation space, suitable for dense electronic assemblies.
Designed to maintain performance under vibration, temperature fluctuation, and mechanical movement.
Compared with single-point grounding methods, the multi-contact structure enhances shielding continuity and reduces electromagnetic leakage.
The spring maintains consistent conductivity over repeated mating cycles without degradation of contact quality.
Compensates for dimensional variation caused by machining tolerances or thermal expansion, ensuring reliable grounding.
Reduces the need for complex grounding clips, braids, or additional fasteners.
Material selection, surface plating, and spring geometry can be adjusted to meet specific shielding and grounding requirements.
Used between housings, covers, and panels to maintain electromagnetic shielding continuity.
Applied in grounding paths for communication equipment, industrial controllers, and electronic enclosures.
Supports stable grounding in systems sensitive to impedance variation and signal interference.
Used in rail transit, automotive electronics, and onboard communication systems requiring robust EMI control.
Suitable for equipment where electromagnetic compatibility and operational reliability are mandatory.
Q1: How does this spring improve EMI shielding?
A: Its multi-point contact structure creates a continuous low-impedance path, enhancing shielding effectiveness.
Q2: Is it suitable for dynamic or vibrating environments?
A: Yes. The uniform contact force helps maintain stable grounding even under vibration.
Q3: Can it replace traditional grounding clips?
A: In many designs, it can simplify grounding structures while improving electrical performance.
Q4: What materials are available?
A: Stainless steel, copper alloy, and specialty conductive materials with optional plating.
Q5: Can the spring be customized?
A: Yes. Dimensions, contact force, and conductive properties can be tailored to project requirements.
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Mobile Phone：+86 17656553585
Email：davykou0@gmail.com
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