Spring contacts are applicable to:
★Centering / concentricity
★Holding / control
★Conducting
★Latching / locking device
★EMI / RFI shielding
★Tolerance compensation
★Grounding
★Sealing
Wire diameter: 0.10mm - 1.5mm
Material: Copper alloy, stainless steel, special alloy, etc.
Surface treatment: Gold plating, silver plating, nickel plating, tin plating; Plating Au/Ag/Ni/Sn
The Uniform-Contact canted coil spring is a precision elastic component engineered to provide continuous, multi-point contact around mating interfaces, ensuring stable electrical grounding and electromagnetic compatibility performance. Its angled coil geometry enables uniform circumferential contact, allowing the spring to adapt to surface irregularities and structural tolerances without compromising performance.
Unlike conventional grounding clips or finger contacts, this canted coil spring delivers controlled contact pressure over a defined working range, maintaining consistent interface continuity even under vibration, thermal expansion, or repeated assembly. At YFS Technology (SZ) Co., Ltd, this product is developed as part of a complete interconnection and grounding strategy, supporting modern electronic systems that demand predictable EMI control and long-term stability.
This type of canted coil spring is particularly suitable for high-frequency environments where signal integrity, shielding effectiveness, and mechanical reliability must be achieved simultaneously.
The angled coil structure creates multiple, evenly distributed contact points around the mating surface, forming a stable grounding path.
Delivers uniform force across the interface, preventing localized stress or performance degradation over time.
Supports stable electromagnetic shielding by maintaining uninterrupted conductive paths between enclosures or modules.
Compensates for machining tolerances, surface roughness, and slight misalignment without loss of contact performance.
Maintains shape and contact characteristics through repeated installation and long-term operation.
Uniform contact pressure helps eliminate gaps that can compromise EMI containment or grounding effectiveness.
Stable grounding minimizes noise coupling and improves overall system electromagnetic performance.
Replaces complex grounding structures with a single, integrated elastic component.
Resists relaxation and fatigue, supporting reliable operation in demanding environments.
Spring diameter, coil density, material, and surface finish can be tailored to system-level requirements.
Applied in base stations, RF modules, and network equipment where grounding continuity is critical.
Used in avionics enclosures and electronic bays requiring reliable EMI control under vibration and temperature variation.
Suitable for control cabinets, embedded systems, and modular electronic assemblies.
Supports shielding integrity in mission-critical electronic platforms.
Ensures stable grounding in sensitive measurement and signal-processing equipment.
Q1: How does this spring improve EMI performance?
A: By maintaining continuous, multi-point conductive contact, it prevents gaps that allow electromagnetic leakage.
Q2: Is it suitable for high-frequency applications?
A: Yes. Its uniform contact design supports stable grounding in high-frequency environments.
Q3: Can it accommodate dimensional tolerances?
A: Yes. The spring adapts to surface variation while maintaining consistent contact force.
Q4: Does vibration affect its performance?
A: No. The elastic structure maintains contact integrity under vibration and mechanical stress.
Q5: Is customization available?
A: Yes. YFS Technology provides tailored designs based on system-level grounding and shielding needs.
Address：Shenzhen City, China
Mobile Phone：+86 17656553585
Email：davykou0@gmail.com
© 2025 YFS Technology （SZ）Co., Ltd All rights reserved.
This website uses cookies to ensure you get the best experience on our website.
Phone