duribility:10,000 cycles
Rated Current:20A-120A
Temperature Rise:30K maximum.
BTB connecting distance:H±0.50mm(customizable)
Low-Profile Structure Board-to-Board Connectors are designed for electronic products where vertical space is extremely limited. By reducing connector height while maintaining stable electrical contact, this type of board-to-board connector supports thinner device designs and higher internal integration levels.
At YFS Technology (SZ) Co., Ltd, low-profile structure board-to-board connectors are developed with a clear focus on mechanical compactness, installation accuracy, and connection stability. These connectors are not simply downsized versions of standard products; they are engineered to balance reduced height with reliable contact performance and structural strength.
Such connectors are widely used in compact electronic systems that require efficient board-level interconnection without increasing enclosure thickness.

As electronic devices continue to move toward thinner and lighter designs, internal connection components must occupy less space without compromising performance. Low-profile structure board-to-board connectors allow multiple circuit boards to be connected within minimal vertical clearance.
YFS Technology designs this connector category with careful control of mating tolerance, contact pressure, and housing structure. The reduced profile helps optimize internal layout while ensuring secure engagement between boards during assembly and operation.
This product category is suitable for applications where space efficiency is a primary design driver.
Optimized structure minimizes vertical space consumption within electronic assemblies.
Contact design ensures consistent electrical transmission despite compact dimensions.
Precision-guided mating helps prevent installation errors and mechanical stress.
Supports overall product weight reduction without sacrificing connection reliability.
Designed for smooth installation in high-density electronic assemblies.
YFS Technology focuses on solving vertical space constraints while maintaining dependable inter-board connectivity.
Housing and contact layout are engineered to deliver stable performance within limited space.
Controlled production processes ensure consistency across compact connector designs.
Low-profile connectors enable more freedom in PCB stacking and enclosure design.
This product integrates easily into complete connector and interconnection solution architectures.
Low-profile structure board-to-board connectors are commonly used in applications that require compact form factors:
Medical diagnostic devices
Portable electronic equipment
Embedded control modules
Communication terminals
UAV onboard electronics
Compact industrial devices
Space-constrained electronic assemblies
These applications benefit from reduced internal height and reliable board-level connections.

This category of low-profile structure board-to-board connectors is available in various configurations to meet different design requirements. Connector structure emphasizes consistent contact performance, accurate mating, and long-term reliability despite compact dimensions.
Material selection and surface finishing are optimized to maintain stable electrical behavior and mechanical durability. Each design supports dependable performance throughout the product lifecycle.
Q1: What is the main benefit of a low-profile board-to-board connector?
It reduces vertical space usage while maintaining stable electrical connections between boards.
Q2: Does reducing connector height affect reliability?
When properly designed, low-profile connectors maintain reliable contact performance and structural stability.
Q3: Are these connectors suitable for compact device manufacturing?
Yes. They are specifically designed for space-limited electronic products.
Q4: Can low-profile connectors support repeated installation?
They are designed to maintain stable performance under controlled mating cycles.
Q5: How do these connectors help with product miniaturization?
By minimizing internal connector height, they allow thinner device designs and higher integration density.
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Mobile Phone:+86 17656553585
Email:davykou0@gmail.com


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