Parameters

duribility:10,000 cycles

Rated Current:20A-120A

Temperature Rise:30K maximum.

BTB connecting distance:H±0.50mm(customizable)

Product Introduction

In the architecture of modern electronics, the humble connection between two circuit boards is a critical determinant of system performance, reliability, and longevity. YFS Technology (SZ) Co., Ltd. introduces the NexLink Board-to-Board Connector System, engineered not merely as a component, but as a foundational solution for signal and power integrity. Designed for engineers confronting the dual challenges of device miniaturization and escalating performance demands, NexLink transforms the board-to-board interface from a potential failure point into a pillar of system robustness. It serves the essential role of bridging digital and power domains within compact, high-function devices across medical, telecommunications, industrial, and next-generation consumer applications.

Product Features

The YFS NexLink system is defined by an integrated suite of features that address the core pain points in electronic design:

Optimized Signal Fidelity: Built from the ground up for electrical performance, the NexLink series minimizes signal degradation. Its design prioritizes controlled impedance, reduced insertion loss, and exceptional isolation to maintain signal clarity in data-intensive environments, from high-speed computing to sensitive analog measurement.

Robust Mechanical Architecture: Reliability is engineered into every mating cycle. Featuring a secure, positive-lock mechanism and a housing constructed from high-performance, temperature-resistant materials, NexLink connectors ensure a stable physical interface resistant to vibration, shock, and the mechanical stresses of real-world use.

Unmatched Design Versatility: Recognizing that no two applications are identical, the NexLink platform offers exceptional configurability. With a range of standardized pitches, stacking heights, and contact arrangements, it provides a scalable solution that adapts to specific spatial, electrical, and budgetary requirements without compromising on core performance.

Manufacturing-Centric Design: Engineered for efficiency, NexLink connectors are designed for seamless integration into high-volume production lines. Compatible with automated placement and reflow processes, they reduce assembly complexity and cost while ensuring consistent, high-quality outcomes.

Product Advantages

Choosing YFS NexLink delivers tangible advantages that extend beyond the connector itself:

Enhanced End-Product Reliability: By providing a more stable and durable interconnection, NexLink directly contributes to the overall reliability and extended service life of the final product, reducing field failure rates and enhancing brand reputation.

Reduced System Design Complexity: The connector’s versatility and performance allow design engineers to simplify board layout, often reducing the need for additional signal conditioning components. This leads to cleaner designs, shorter development cycles, and lower overall bill-of-material costs.

Future-Proofing for Evolving Standards: The electrical and mechanical headroom built into the NexLink design ensures compatibility with evolving protocols and increasing data rates. This protects your design investment against premature obsolescence.

Direct Engineering Partnership: YFS Technology provides more than just components. Our technical support team offers application expertise, helping to select the optimal configuration and integrate the NexLink system seamlessly into your design, mitigating risk and accelerating time-to-market.

Product Applications

The NexLink system is engineered to excel in environments where performance cannot be compromised:

Medical & Diagnostic Equipment: Provides reliable, low-noise interconnections in patient monitors, imaging systems (MRI, ultrasound), and portable diagnostic devices, where signal accuracy is paramount.

Telecommunications & 5G Infrastructure: Delivers the signal integrity and environmental durability required for base station radios, network switches, and optical transport equipment, ensuring uninterrupted data flow.

Industrial Automation & Control: Withstands the harsh conditions of factory floors, offering vibration resistance and long-term stability in PLCs, motor drives, robotics, and industrial IoT gateways.

Automotive Electronics: Meets the rigorous demands of automotive applications, including ADAS sensors, infotainment systems, and battery management controllers, where temperature cycling and reliability are critical.

High-Performance Computing & Consumer Tech: Enables compact, high-speed data transfer within servers, data storage arrays, advanced gaming systems, and premium audio/video equipment.

FAQ Section

Q: How do I select the right NexLink connector for my application?
A: The optimal choice depends on your specific requirements for signal type (high-speed digital, analog, power), board spacing (stacking height), available PCB real estate (pitch), and environmental conditions. Our product selection guide and application engineers can help you navigate these parameters quickly.

Q: Are evaluation samples available for testing?
A: Yes. We encourage and support design validation. Evaluation kits and samples for our standard NexLink configurations are available to qualified customers to test fit, form, and function within your prototype.

Q: What level of technical documentation and design support do you provide?
A: We provide comprehensive support packages that include detailed 3D CAD models (STEP files), recommended PCB land patterns, material specifications, and application notes. For complex projects, our engineering team is available for direct consultation.

Q: Can the NexLink system be customized if my needs aren't met by a standard product?
A: Absolutely. Our engineering team specializes in developing modified or fully custom connector solutions based on the robust NexLink platform to meet unique application challenges in terms of pinout, form factor, or performance specifications.

Q: How does YFS Technology ensure consistent quality and supply?
A: We maintain stringent quality control processes aligned with international standards. Our vertically integrated manufacturing and strategic supply chain partnerships are designed to ensure consistent product quality and reliable, on-time delivery, even for high-volume orders.