duribility:10,000 cycles
Rated Current:20A-120A
Temperature Rise:30K maximum.
BTB connecting distance:H±0.50mm(customizable)
The PrecisionStack Series represents a comprehensive approach to board-to-board connectivity, engineered to deliver consistent performance across various stacking configurations and environmental conditions. Unlike single-purpose connectors, this series provides a versatile platform supporting multiple pitch options, current ratings, and mechanical configurations within a unified design framework. Developed through extensive market research and engineering collaboration, these connectors address the evolving needs of electronics manufacturers seeking reliable interconnection solutions that scale from prototype to mass production without compromising performance or reliability.
This connector series bridges the gap between ultra-miniaturized consumer applications and demanding industrial environments, offering a balanced solution that prioritizes both electrical performance and mechanical robustness. The design incorporates lessons learned from thousands of customer applications across telecommunications, medical devices, industrial controls, and consumer electronics, resulting in a connector that performs predictably across diverse use cases.

Mechanical Design Excellence
Modular contact system supporting 0.5mm, 0.8mm, and 1.0mm pitch configurations within compatible housing architecture
Stacking height options ranging from 3mm to 25mm with precise 0.5mm increments for design flexibility
Reinforced housing construction utilizing 30% glass-filled LCP material for dimensional stability
Multi-point latching mechanism with audible engagement confirmation and visual position indicators
Anti-wicking barrier design preventing solder migration during reflow processes
Polarization features preventing incorrect mating orientation in multi-connector arrays
Design Flexibility for Evolving Requirements
The PrecisionStack Series offers unprecedented configuration flexibility, allowing engineers to mix signal, power, and ground contacts within the same connector footprint. This modular approach enables optimized board layouts without the compromise typically associated with standardized connector offerings. Designers can select from 15 standard contact arrangements or work with our engineering team to develop custom configurations for specific applications, reducing overall system size and complexity while maintaining performance targets.
Manufacturing Efficiency and Reliability
Advanced manufacturing processes ensure consistent quality across high-volume production runs. The connectors feature precision-molded components with dimensional tolerances of ±0.03mm, enabling reliable automated assembly and reducing manufacturing defects. Gold plating thickness is precisely controlled between 0.3μm and 0.76μm depending on application requirements, providing optimal wear resistance and electrical performance. Tape-and-reel packaging compatible with industry-standard automated placement equipment reduces assembly time and improves production throughput.
Long-Term Performance Consistency
Extensive reliability testing validates performance under real-world conditions. The dual-beam contact design provides redundant current paths, maintaining electrical continuity even if one contact surface becomes compromised. The housing material maintains mechanical properties across the full operating temperature range, preventing warping or distortion that could affect mating reliability. The latching mechanism undergoes rigorous cycle testing, demonstrating consistent engagement force through 100 mating cycles with minimal variation.
Telecommunications Infrastructure
5G base stations utilize these connectors for inter-board connections in radio units and baseband processing equipment, where signal integrity and thermal management are critical. The connectors support high-speed data transmission between RF modules and digital processing boards while withstanding outdoor environmental conditions.
Medical Diagnostic Equipment
Patient monitoring systems and portable diagnostic devices benefit from the connectors' reliable performance in clinical environments. The low-profile options enable compact device designs while maintaining electrical isolation between sensitive measurement circuits and power systems.
Industrial Automation Systems
Programmable logic controllers, motor drives, and sensor interfaces employ these connectors for their vibration resistance and long-term reliability in manufacturing environments. The power contacts support motor control applications while signal contacts handle sensor data and communication protocols.
Consumer Electronics
Gaming consoles, smart home devices, and portable audio equipment utilize the connectors' space-efficient designs and reliable performance in consumer applications. The aesthetic options and reliable mating characteristics support both manufacturing efficiency and end-user satisfaction.
Automotive Electronics
Advanced driver assistance systems and infotainment units benefit from connectors meeting automotive temperature and vibration requirements while supporting mixed signal and power transmission in space-constrained vehicle electronics.
Q: What is the recommended PCB layout for these connectors?
A: We provide detailed layout guidelines including pad geometry, solder mask openings, and escape routing recommendations. Generally, we recommend 0.2mm clearance between pads and adjacent traces, with ground pours surrounding high-speed signals for optimal performance.
Q: How do these connectors compare to competitive offerings?
A: Independent testing shows 25% better vibration resistance and 15% lower contact resistance compared to similar pitch connectors in the market. The modular contact system provides greater configuration flexibility than fixed-contact designs from other manufacturers.
Q: What quality certifications are available?
A: The series is available with UL, CSA, and EN certification. Specific configurations can be certified to IEC 60601-1 for medical applications or ISO 16750 for automotive applications upon request.
Q: Can these connectors support high-speed signals?
A: Yes, specific configurations support data rates up to 12Gbps with appropriate PCB layout. We provide signal integrity analysis reports and simulation models for high-speed applications.
Q: What is the lead time for custom configurations?
A: Standard configurations ship from stock, while custom arrangements typically require 8-12 weeks for initial samples and production tooling. We offer expedited development for qualified volume applications.
Q: How are these connectors packaged for automated assembly?
A: Standard packaging is tape-and-reel compatible with EIA-481-C specifications. Custom reel sizes and packaging configurations are available for high-volume manufacturing requirements.
Q: What technical support is available during design implementation?
A: We provide comprehensive design-in support including 3D models, PCB footprint files, thermal analysis, and signal integrity simulations. Our engineering team is available for design reviews and application-specific recommendations.
Address:Shenzhen City, China
Mobile Phone:+86 17656553585
Email:davykou0@gmail.com


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