Parameters

duribility:10,000 cycles

Rated Current:20A-120A

Temperature Rise:30K maximum.

BTB connecting distance:H±0.50mm(customizable)

Product Introduction

High-density board-level board-to-board connectors are designed to establish stable electrical connections between printed circuit boards within compact electronic assemblies. By enabling direct board stacking or parallel board integration, these connectors help reduce internal wiring, improve layout efficiency, and support modular system design.

At YFS Technology (SZ) Co., Ltd, this type of board-to-board connector is developed as part of our connector solution framework, focusing on system compatibility, installation reliability, and long-term operational stability. Instead of treating the connector as an isolated part, we design it based on real application conditions such as signal routing density, board spacing accuracy, and mechanical tolerance.

These connectors are widely used in electronic systems where space optimization, signal integrity, and assembly efficiency are critical.

Product Overview

High-density board-level board-to-board connectors allow multiple circuit boards to be interconnected within limited enclosure space. Their compact structure supports high contact density while maintaining consistent electrical and mechanical performance.

YFS Technology designs this category with attention to contact arrangement, mating precision, and structural stability. The connector layout supports reliable signal paths while reducing interference caused by misalignment or vibration. This makes the product suitable for modern electronic equipment with increasing integration requirements.

Product Features

High Contact Density

Designed to accommodate multiple signal paths within a limited footprint, supporting complex PCB layouts.

Stable Electrical Interface

Optimized contact structures help maintain consistent electrical transmission between connected boards.

Precise Mating Design

Controlled alignment reduces mechanical stress during installation and operation.

Compact Board-Level Structure

Supports space-saving electronic designs without compromising connection reliability.

Assembly Compatibility

Suitable for board-level installation processes and consistent production workflows.

Product Advantages

System-Oriented Design Philosophy

YFS Technology develops board-to-board connectors based on complete system requirements rather than individual specifications.

Reliable Manufacturing Control

Consistent production processes ensure uniform performance across different batches.

Adaptable Structural Options

Connector height, contact arrangement, and housing structure can be adjusted for different PCB layouts.

Long-Term Performance Stability

Durable materials and controlled surface treatment help maintain contact reliability over extended use.

Integration with Connector Solutions

This product can be combined with other interconnection components and cable assemblies as part of a unified solution.

Product Applications

High-density board-level board-to-board connectors are commonly used in applications that require compact internal structure and dependable board interconnection:

Industrial automation control units

Automotive electronic modules

Medical monitoring and diagnostic equipment

Communication terminals and embedded systems

Robotics control platforms

UAV electronic assemblies

Compact electronic devices

Each application benefits from simplified internal wiring and stable board-level connectivity.

Frequently Asked Questions (FAQ)

Q1: What makes this board-to-board connector suitable for high-density designs?
Its compact structure allows multiple contacts within a limited board area while maintaining stable performance.

Q2: Can this connector be used for modular electronic systems?
Yes. It supports modular PCB integration and flexible system architecture.

Q3: Is this product compatible with automated assembly?
It is designed to support consistent board-level installation processes in production environments.

Q4: Can the connector structure be adjusted for different projects?
Structural parameters can be adapted based on specific PCB layout and application needs.

Q5: How does this connector improve system reliability?
By ensuring accurate alignment, stable contact performance, and reduced mechanical stress between boards.